With the strict demand for production quality in the semiconductor industry, a large number of automatic manufacturing and processing equipment are needed. These equipment have high scientific and technological content, great manufacturing difficulty and high equipment value, which promotes the continuous development and growth of machine vision skills.
Machine vision is divided into four aspects according to application functions: measurement, detection, recognition and positioning. In the detection link, 3C automation equipment has the highest application, and 70% of machine vision units are applied in this link. In practical application, the machine vision detection system can quickly detect the wrong sequence of wiring, whether the electronic components are installed incorrectly or not, and whether the connector and battery size are in compliance.
Driven by the increasing popularity of large-scale integrated circuits in the semiconductor industry, the demand for output and quality in the industry is increasing sharply. On the premise of reducing the cost of productivity, machine vision technology plays an indispensable role, and the requirements of machine vision technology continue to push through the old and bring forth the new.
Specifically, the application of machine vision in the field of electronic manufacturing is mainly to guide the robot to carry out high-precision PCB positioning and SMT component placement, as well as surface detection. It is mainly used in PCB printed circuit, electronic packaging, screen printing, SMT surface mounting, SPI solder paste detection, reflow soldering and wave soldering.
Machine vision needs to gradually penetrate around the semiconductor market and gradually expand its share in its field. So, what are the advantages of machine vision in the semiconductor industry?
1. Application in appearance inspection of small electronic components and small-size industrial products, SMD products and silicon wafers. The detected contents include printing error, content error, image error, direction error, missing printing and surface defects. After high-speed and automatic photographing of the surface of the tested object, the data is transmitted to the computer for processing to find out the defective products.
2. The application of flatness detection in IC chip and electronic linker detects the number of pins and the geometric dimensions of multiple positions of pins, including pitch interval, width, height, curvature and so on. It realizes the continuous, efficient and fast appearance detection of the chip, improves the detection efficiency, saves labor cost, reduces the labor intensity of workers, and more importantly, ensures the detection accuracy.
3. PCB printed circuit inspection, board component position, solder joint, circuit, opening size and angle measurement; Computer micro communication interface and SIM card slot; SMT component placement, surface mounting and surface inspection; SPI solder paste detection, reflow soldering and wave soldering; Detection and measurement of the number of cable connectors, etc.
Visual inspection system has been successfully applied and widely praised in electronics, packaging, printing, chemical industry, food, plastic, textile and other industries. Through the on-site application of machine vision inspection system, manufacturers can not only monitor product production quality in real time and improve production efficiency, but also greatly save labor cost, It is the best choice for manufacturing industry in the era of industry 4.0.